Transistor structure, display device including transistor structure, and method of manufacturing transistor structure

ABSTRACT

A transistor structure may include a first electrode, a second electrode, a third electrode, a substrate, and a semiconductor member. The semiconductor member overlaps the third electrode and includes a first semiconductor portion, a second semiconductor portion, and a third semiconductor portion. The first semiconductor portion directly contacts the first electrode, is directly connected to the third semiconductor portion, and is connected through the third semiconductor portion to the second semiconductor portion. The second semiconductor portion directly contacts the second electrode and is directly connected to the third semiconductor portion. A minimum distance between the first semiconductor portion and the substrate is unequal to a minimum distance between the second semiconductor portion and the substrate.

This application is a divisional application of U.S. patent applicationSer. No. 15/473,356 filed Mar. 29, 2017, which claims priority to andbenefit from Korean Patent Application No. 10-2016-0053025 filed on Apr.29, 2016 in the Korean Intellectual Property Office; the disclosure ofthe Korean Patent application is incorporated herein by reference in itsentirety.

BACKGROUND 1. Field

The technical field relates to a transistor structure, a liquid crystaldisplay device including the transistor structure, and a method ofmanufacturing the transistor structure.

2. Description of the Related Art

A display device may display images according to input signals. Varioustypes of display devices may include liquid crystal display (LCD)devices, organic light emitting display (OLED) devices, and others.

A display device, such as a liquid crystal display device, may includefield generating electrodes, such as a pixel electrode and a commonelectrode, and a liquid crystal layer. A voltage may be applied to thefield generating electrodes to generate an electric field in the liquidcrystal layer for controlling transmission of incident light, therebydisplaying an image.

A display device may include a transistor and a light-blocking member.The transistor may control application of the voltage and may bedisposed in a light blocking region covered by the light-blockingmember. The size of the light blocking region may affect quality ofimages displayed by the display device.

SUMMARY

In an embodiment, an array substrate may be/include a transistorstructure.

An embodiment may be related to an array substrate including a pixelhaving a high aperture ratio.

An embodiment may be related to an array substrate including a thin filmtransistor having stable electrical characteristics.

An embodiment may be related to an array substrate suitable for ahigh-resolution display device.

An embodiment may be related to a display device, e.g., a liquid crystaldisplay device, having a high aperture ratio.

An embodiment may be related to a display device, e.g., a liquid crystaldisplay device, including a thin film transistor having stableelectrical characteristics.

An embodiment may be related to a display device, e.g., a liquid crystaldisplay device, including an array substrate suitable for ahigh-resolution display device.

An embodiment may be related to a method of manufacturing an arraysubstrate including a pixel having a high aperture ratio.

An embodiment may be related to a method of manufacturing an arraysubstrate including a thin film transistor having stable electricalcharacteristics.

An embodiment may be related to a method of manufacturing an arraysubstrate suitable for a high-resolution display device.

According an embodiment, an array substrate (which may be/include atransistor structure) may include the following elements: a firstsubstrate (or base substrate); a structural member disposed on the firstsubstrate, including an upper surface positioned over the upper surfaceof the first substrate, and including a lateral surface extending fromthe upper surface of the structural member toward the upper surface ofthe first substrate; a gate electrode disposed on the lateral surface ofthe structural member; a source electrode and a drain electrodeinsulated from the gate electrode and spaced apart from each other; anda semiconductor member contacting each of the source electrode and thedrain electrode, wherein either the source electrode or the drainelectrode is disposed on the upper surface of the structural member.

The gate electrode may be disposed on the lateral surface of thestructural member.

The lateral surface of the structural member may include an inclinedsurface, and the gate electrode may be disposed along the inclinedsurface.

The semiconductor member may be disposed on the gate electrode, and mayinclude an inclined surface having the same slope as the inclinedsurface of the lateral surface of the structural member.

The array substrate may include a channel electrically connecting thesource electrode and the drain electrode, wherein the channel extendsalong the inclined surface of the semiconductor member. The channel maybe part of the semiconductor member.

One end of the gate electrode may overlap the upper surface of thestructural member in a vertical direction, and the other end of the gateelectrode may not overlap the upper surface of the structural member inthe vertical direction.

One end of the semiconductor member may overlap the upper surface of thestructural member in a vertical direction, and the other end of thesemiconductor member may not overlap the upper surface of the structuralmember in the vertical direction.

The semiconductor member may overlap the lateral surface of thestructural member in a horizontal direction.

The angle between the lateral surface of the structural member and theupper surface of the first substrate may be a right angle.

The angle between the lateral surface of the structural member and theupper surface of the first substrate may be an acute angle.

The array substrate may further include the following elements: a gateline connected with the gate electrode and extending in a firstdirection; and a data line connected with the source electrode andextending in a second direction, wherein a part of the data line isdisposed on the structural member.

The source electrode and the drain electrode may be disposed on the gateelectrode.

The gate electrode may be disposed on the source electrode and the drainelectrode.

The source electrode and the drain electrode may be disposed ondifferent levels.

The array substrate may further include: a pixel electrode electricallyconnected with the drain electrode.

One end of the semiconductor member may be in contact with the lowersurface of the source electrode, and the other end of the semiconductormember may be in contact with the upper surface of the drain electrode.

According an embodiment, an array substrate (which may be/include atransistor structure) may include the following elements: a firstsubstrate; a first pixel and a second pixel disposed on the firstsubstrate and positioned adjacent to each other; and a structural memberdisposed over the first pixel and the second pixel, including an uppersurface positioned over the upper surface of the first substrate, andincluding a lateral surface extending from the upper surface toward theupper surface of the first substrate. The first pixel includes thefollowing elements: a first gate electrode disposed on the structuralmember; a first source electrode and a first drain electrode insulatedfrom the first gate electrode and spaced apart from each other; and afirst semiconductor member contacting each of the first source electrodeand the first drain electrode. The second pixel includes the followingelements: a second gate electrode disposed on the structural member; asecond source electrode and a second drain electrode insulated from thesecond gate electrode and spaced apart from each other; and a secondsemiconductor member contacting each of the second source electrode andthe second drain electrode. Either one of the first source electrode andthe first drain electrode and either one of the second source electrodeand the second drain electrode are disposed on the upper surface of thestructural member.

The array substrate may further include the following elements: a firstdata line connected with the first source electrode; and a second dataline connected with the second source electrode, wherein at least oneselected from a part of the first data line and a part of the seconddata line is disposed on the upper surface of the structural member.

A part of the first data line may overlap the upper surface of thestructural member in a vertical direction, and a part of the second dataline may not overlap the upper surface of the structural member in thevertical direction.

The part of the first data line and the part of the second data line maybe disposed on the upper surface of the structural member to be adjacentto each other.

The first gate electrode may be disposed on the first source electrodeand the first drain electrode, and the second gate electrode may bedisposed on the second source electrode and the second drain electrode.

The first source electrode and the first drain electrode may be disposedon the first gate electrode, and the second source electrode and thesecond drain electrode may be disposed on the second gate electrode.

According an embodiment, a display device, e.g., a liquid crystaldisplay device, may include the following elements: a first substrate; astructural member which is disposed on the first substrate, includes anupper surface positioned over the upper surface of the first substrate,and includes a lateral surface extending from the upper surface towardthe upper surface of the first substrate; a gate electrode disposed onthe structural member; a source electrode and a drain electrodeinsulated from the gate electrode and spaced apart from each other; anda semiconductor member contacting each of the source electrode and thedrain electrode; and a second substrate facing the first substrate,wherein either the source electrode or the drain electrode is disposedon the upper surface of the structural member.

A color filter overlapping the pixel electrode and a black matrix may bedisposed on the second substrate. The black matrix may overlap (andcover) the source electrode, the drain electrode, and the semiconductormember.

The liquid crystal display device may further include a common electrodedisposed entirely on the color filter and the black matrix.

A color filter may be disposed on the pixel electrode of the firstsubstrate, and a black matrix may be disposed on the source electrode,the drain electrode, and the semiconductor member.

According an embodiment, a method of manufacturing an array substrate(which may be/include a transistor structure) may include the followingsteps: forming on a first substrate a structural member, the structuralmember including an upper surface positioned over the upper surface ofthe first substrate and including a lateral surface extending from theoutside of the upper surface toward the upper surface of the firstsubstrate; forming a gate electrode on the structural member; forming asemiconductor member on the gate electrode; and forming a sourceelectrode and a drain electrode spaced apart from each other to beinsulated from the gate electrode, wherein either the source electrodeor the drain electrode is formed on the upper surface of the structuralmember.

According an embodiment, provided a method of manufacturing an arraysubstrate (which may be/include a transistor structure) may include thefollowing steps: forming on a first substrate a structural member, thestructural member including an upper surface positioned over the uppersurface of the first substrate and including a lateral surface extendingfrom the upper surface toward the upper surface of the first substrate;forming a semiconductor member on the structural member; forming asource electrode and a drain electrode spaced apart from each other onthe semiconductor member, wherein either the source electrode or thedrain electrode is formed on the upper surface of the structural member;and forming a gate electrode on the semiconductor member.

An embodiment may be related to a transistor structure. The transistorstructure may be included in a display device. The transistor structuremay include a first electrode, a second electrode, a third electrode, asubstrate, and a first semiconductor member. The first electrode mayfunction as a source electrode or a drain electrode of a transistor. Thesecond electrode may function as a drain electrode or a source electrodeof the transistor. The third electrode may function as a gate electrodeof the transistor. The substrate may overlap each of the firstelectrode, the second electrode, and the third electrode. The firstsemiconductor member may overlap the third electrode and may include afirst semiconductor portion, a second semiconductor portion, and a thirdsemiconductor portion. The first semiconductor portion may directlycontact the first electrode, may not directly contact the secondelectrode, may be directly connected to the third semiconductor portion,and may be connected through the third semiconductor portion to thesecond semiconductor portion. The second semiconductor portion maydirectly contact the second electrode, may not directly contact thefirst electrode, and may be directly connected to the thirdsemiconductor portion. A minimum distance between the firstsemiconductor portion and the substrate may be unequal to a minimumdistance between the second semiconductor portion and the substrate.

Each of the first semiconductor portion, the second semiconductorportion, and the third semiconductor portion may be (substantially)flat. A maximum thickness of the first semiconductor portion in adirection perpendicular to contact side of the first semiconductorportion, a maximum thickness of the second semiconductor portion in adirection perpendicular to a contact side of the second semiconductorportion, and a maximum thickness of the third semiconductor portion in adirection perpendicular to contact side of the third semiconductorportion may be equal to one another. The third semiconductor portion mayoverlap the third electrode, may be spaced and/or separated from thethird electrode, and may not be aligned with either of the firstsemiconductor portion and the second semiconductor portion.

The third semiconductor portion may extend at a first angle with respectto the first semiconductor portion in a cross-sectional view of thetransistor structure. The first angle may be greater than 0 degree andless than 180 degrees.

The first angle may be less than or equal to 90 degrees.

The first angle may be greater than 90 degree and less than 180 degrees.

The third semiconductor portion may directly contact the firstelectrode.

The third semiconductor portion may extend at a second angle withrespect to the second semiconductor portion in the cross-sectional viewof the transistor structure. The second angle may be greater than 0degree and less than 180 degrees.

The second angle may be less than or equal to 90 degrees.

The second angle may be greater than 90 degree and less than 180degrees.

The first angle may be equal to the second angle.

The third semiconductor portion may directly contact the secondelectrode.

The third semiconductor portion may extend at a third angle with respectto a side of the substrate in the cross-sectional view of the transistorstructure. The third angle may be greater than 0 degree and less than180 degrees.

The third angle may be complementary to at least one of the first angleand the second angle.

The third semiconductor portion may extend at an inclination angle withrespect to a side (e.g., top/bottom side) of the substrate in across-sectional view of the transistor structure. The inclination anglemay be greater than 0 degree and less than 180 degrees. The thirdsemiconductor portion may extend at an included angle with respect tothe first semiconductor portion in the cross-sectional view of thetransistor structure. The inclination angle may be a complementary angleto the included angle.

The first semiconductor portion may be positioned between a portion ofthe first electrode and the substrate in a direction perpendicular to aside (e.g., top/bottom side) of the substrate. A portion of the secondelectrode may be positioned between the second semiconductor portion andthe substrate in the direction perpendicular to the side of thesubstrate.

The third electrode (e.g., a gate electrode) may include a firstconductive portion, a second conductive portion, and a third conductiveportion. The first conductive portion may overlap the firstsemiconductor portion (in a direction perpendicular to a side of thesubstrate), may be directly connected to the third conductive portion,and may be connected through the third conductive portion to the secondconductive portion. The second conductive portion may overlap the secondsemiconductor portion (in the direction perpendicular to a side of thesubstrate) and may be directly connected to the third conductiveportion. A minimum distance between the first conductive portion and thesubstrate may be unequal to a minimum distance between the secondconductive portion and the substrate.

The transistor structure may include a structural member. The structuralmember may be positioned between the first semiconductor portion and thesubstrate in a direction perpendicular to a side (e.g., top/bottom side)of the substrate. The minimum distance between the first semiconductorportion and the substrate may be greater than the minimum distancebetween the second semiconductor portion and the substrate by a firstamount. The first amount may be greater than 0 and may be less than orequal to a thickness of the structural member.

The first amount may be equal to the thickness of the structural member.

The thickness of the structural member may be greater than a thicknessof the second electrode (in a direction of the thickness of thestructural member). The first amount may be equal to the thickness ofthe structural member minus the thickness of the second electrode.

A minimum distance between the first electrode (e.g., a source/drainelectrode) and the substrate may be greater than a minimum distancebetween the second electrode (e.g., a drain/source electrode) and thesubstrate by the thickness of the structural member.

The third electrode (e.g., a gate electrode) may include a firstconductive portion, a second conductive portion, and a third conductiveportion. The first conductive portion may overlap the firstsemiconductor portion (in a direction perpendicular to a side of thesubstrate), may be directly connected to the third conductive portion,and may be connected through the third conductive portion to the secondconductive portion. The second conductive portion may overlap the secondsemiconductor portion (in the direction perpendicular to a side of thesubstrate) and may be directly connected to the third conductiveportion. A minimum distance between the first conductive portion and thesubstrate may be greater than a minimum distance between the secondconductive portion and the substrate by a second amount. The secondamount may be greater than 0 and may be less than or equal to thethickness of the structural member.

The second amount may be equal to the thickness of the structuralmember.

The transistor structure may include a fourth electrode (e.g., a secondsource/drain electrode), a fifth electrode (e.g., a second drain/sourceelectrode), a sixth electrode (e.g., a second gate electrode), a secondsemiconductor member, and an insulating film (or gate insulating film).The second semiconductor member may overlap the sixth electrode and mayinclude a fourth semiconductor portion, a fifth semiconductor portion,and a sixth semiconductor portion. The insulating film may directlycontact each of the third electrode, the sixth electrode, the firstsemiconductor member, the second semiconductor member, and thestructural member. The fourth semiconductor portion may directly contactthe fourth electrode, may not directly contact the fifth electrode, maybe directly connected to the sixth semiconductor portion, and may beconnected through the sixth semiconductor portion to the fifthsemiconductor portion. The fifth semiconductor portion may directlycontact the fifth electrode, may not directly contact the fourthelectrode, and may be directly connected to the sixth semiconductorportion. A minimum distance between the fourth semiconductor portion andthe substrate may be unequal to a minimum distance between the fifthsemiconductor portion and the substrate. The structural member mayinclude a first structural part, a second structural part, and a thirdstructural part. The first structural part may directly contact exactlyone of the third electrode and the first semiconductor member, may bedirectly connected to the third structural part, and may be connectedthrough the third structural part to the second structural part. Thesecond structural part may directly contact exactly one of the sixthelectrode and the second semiconductor member and may be directlyconnected to the third structural part. The third structural part maydirectly contact the insulating film.

An embodiment may be related to a display device. The display device maybe/include a liquid crystal display device and/or an organic lightemitting display device. The display device may include a firstelectrode, a second electrode, a third electrode, a substrate, asemiconductor member, and a structural member. The substrate may overlapeach of the first electrode, the second electrode, and the thirdelectrode. The semiconductor member may overlap the third electrode andmay include a first semiconductor portion, a second semiconductorportion, and a third semiconductor portion. The structural member may bepositioned between the first semiconductor portion and the substrate ina direction perpendicular to a side of the substrate. The firstsemiconductor portion may directly contact the first electrode, may bedirectly connected to the third semiconductor portion, and may beconnected through the third semiconductor portion to the secondsemiconductor portion. The second semiconductor portion may directlycontact the second electrode and may be directly connected to the thirdsemiconductor portion. A minimum distance between the firstsemiconductor portion and the substrate may be greater than a minimumdistance between the second semiconductor portion and the substrate by afirst amount. The first amount may be greater than 0 and may be lessthan or equal to a thickness of the structural member.

The display device may include a black matrix. The first semiconductorportion may be positioned between the black matrix and the structuralmember in the direction perpendicular to the side of the substrate. Thethird semiconductor portion may be positioned over the structural memberin a direction parallel to the side of the substrate.

An embodiment may be related to a method for manufacturing a transistorstructure. The method may include the following steps: providing a firstelectrode; providing a second electrode; providing a third electrode;providing a substrate, which may overlap each of the first electrode andthe second electrode; and providing a semiconductor member, which mayoverlap the third electrode and may include a first semiconductorportion, a second semiconductor portion, and a third semiconductorportion. The first semiconductor portion may directly contact the firstelectrode, may be directly connected to the third semiconductor portion,and may be connected through the third semiconductor portion to thesecond semiconductor portion. The second semiconductor portion maydirectly contact the second electrode and may be directly connected tothe third semiconductor portion. A minimum distance between the firstsemiconductor portion and the substrate may be unequal to a minimumdistance between the second semiconductor portion and the substrate.

According to embodiments, the horizontal area of a transistor in a pixelof an array substrate (or transistor structure) can be minimized, suchthat the aperture ratio of the pixel of the array substrate (ortransistor structure) can be maximized. According to embodiments, asufficient channel length in the transistor may be implemented, suchthat performance of the transistor may be desirable. Advantageously,satisfactory image display quality may be attained. In embodiments, thearray substrate (or transistor structure) is suitable for ahigh-resolution display device.

Embodiments are not limited by the foregoing, and other effects arepractical.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of an array substrate (and/or atransistor structure) according to an embodiment.

FIG. 2 is an enlarged plan view of the portion “A” of FIG. 1 accordingto an embodiment.

FIG. 3 is a cross-sectional view taken along the line I-I′ of FIG. 2according to an embodiment.

FIG. 4 is a cross-sectional view of an array substrate (and/or atransistor structure) according to an embodiment.

FIG. 5 is a cross-sectional view of an array substrate (and/or atransistor structure) according to an embodiment.

FIG. 6 is a cross-sectional view of an array substrate (and/or atransistor structure) according to an embodiment.

FIG. 7 is a plan view of an array substrate according (and/or atransistor structure) to an embodiment.

FIG. 8 is a cross-sectional view taken along the line II-II′ of FIG. 7according to an embodiment.

FIG. 9 is a plan view of an array substrate (and/or a transistorstructure) according to an embodiment.

FIG. 10 is a cross-sectional view taken along the line III-III′ of FIG.9 according to an embodiment.

FIG. 11 is a plan view of an array substrate (and/or a transistorstructure) according to an embodiment.

FIG. 12 is a cross-sectional view taken along the line IV-IV′ of FIG. 11according to an embodiment.

FIG. 13 is a plan view of an array substrate (and/or a transistorstructure) according to an embodiment.

FIG. 14 is a cross-sectional view taken along the line V-V′ of FIG. 13according to an embodiment.

FIG. 15 is a cross-sectional view of a display device, e.g., a liquidcrystal display device, according to an embodiment.

FIG. 16 is a cross-sectional view of a display device, e.g., a liquidcrystal display device, according to an embodiment.

FIG. 17 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 18 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 19 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 20 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 21 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 22 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 23 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 24 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 25 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 26 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 27 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

FIG. 28 is a cross-sectional view illustrating a method of manufacturingan array substrate (and/or a transistor structure) according to anembodiment.

DETAILED DESCRIPTION OF EMBODIMENTS

Example embodiments to be are described in detail with reference to theaccompanying drawings. Possible embodiments are not limited to thedescribed embodiments and can be implemented in various forms.

Although the terms “first”, “second”, etc. may be used herein todescribe various elements, these elements should not be limited by theseterms. These terms may be used to distinguish one element from anotherelement. Thus, a first element discussed in this application may betermed a second element without departing from embodiments. Thedescription of an element as a “first” element may not require or implythe presence of a second element or other elements. The terms “first”,“second”, etc. may also be used herein to differentiate differentcategories or sets of elements. For conciseness, the terms “first”,“second”, etc. may represent “first-category (or first-set)”,“second-category (or second-set)”, etc., respectively.

If a first element (such as a layer, film, region, or substrate) isreferred to as being “on”, “neighboring”, “connected to”, or “coupledwith” a second element, then the first element can be directly on,directly neighboring, directly connected to, or directly coupled withthe second element, or an intervening element may also be presentbetween the first element and the second element. If a first element isreferred to as being “directly on”, “directly neighboring”, “directlyconnected to”, or “directed coupled with” a second element, then nointended intervening element (except environmental elements such as air)may be provided between the first element and the second element.

Illustrations of example embodiments in the figures may representidealized illustrations. Variations from the shapes illustrated in theillustrations, as a result of, for example, manufacturing techniquesand/or tolerances, may be possible. Thus, the example embodiments shouldnot be construed as limited to the shapes or regions illustrated hereinbut are to include deviations in the shapes. For example, an etchedregion illustrated as a rectangle may have rounded or curved features.The shapes and regions illustrated in the figures are illustrative andshould not limit the scope of the example embodiments.

In this application, an “array substrate” may be a transistor structureor may include a transistor structure.

FIG. 1 is a schematic plan view of an array substrate (and/or atransistor substrate) according to an embodiment. FIG. 2 is an enlargedplan view of the portion “A” of FIG. 1 . FIG. 3 is a cross-sectionalview taken along the line I-I′.

Referring to FIGS. 1 to 3 , the array substrate according to anembodiment includes a first substrate 500; a structural member PTdisposed on the first substrate 500; a gate electrode GE disposed on thestructural member PT; a source electrode SE and a drain electrode DEinsulated from the gate electrode GE and space apart from each other;and a semiconductor member 700 disposed between the source electrode SEand the drain electrode DE.

The first substrate 500 may be made of a material having heat resistanceand transparency. For example, the first substrate 500 may be made oftransparent glass or plastic. A display area DA and a non-display areaNDA are defined on the first substrate 500.

The display area DA is an area in which an image is displayed, and thenon-display area NDA is an area in which various signal lines arearranged in order to display an image in the display area.

The non-display area NDA may be provided with a plurality of datadrivers DU for providing data signals to data lines DL and a pluralityof data fan-out lines DFL for transmitting the signals provided from thedata drivers DU to the data line DL.

More specifically explaining the display area DA, a plurality of pixelsformed by crossing a plurality of data lines DL and a plurality of gatelines GL each other may be arranged on the display area DA. FIG. 2 is anenlarged plan view of one pixel (portion “A” of FIG. 1 ) of theplurality of pixels. The display area DA may include pixels, each ofwhich is substantially the same as this pixel. For convenience ofexplanation, one pixel of adjacent pixels will be referred to as a firstpixel PX1, and the other pixel thereof will be referred to as a secondpixel PX2. The first pixel PX1 and the second pixel PX2 may havesubstantially the same shape, or may have shapes substantiallysymmetrical and/or analogous to each other. In an embodiment, since thefirst pixel PX1 and the second pixel PX2 have substantially the sameshape in the embodiment of FIGS. 1 to 3 , description of the firstpixels (PX1) may be substantially applicable to the second pixels (PX2).

The structural member PT may be disposed on the first substrate 500. Thestructural member PT may protrude by a predetermined distance from/overthe upper surface of the first substrate 500.

The structural member PT may include an upper surface PT_s and a lateralsurface PT_h extending from an edge of the upper surface PT_s toward theupper surface of the first substrate 500. The upper surface PT_s of thestructural member PT may include a substantially planarized and/or levelsurface, and the lateral surface PT_h of the structural member PT mayinclude an inclined surface.

The upper end of the inclined surface of the lateral surface PT_h of thestructural member PT may be in direct contact with the upper surfacePT_s of the structural member PT, and the lower end of the inclinedsurface of the lateral surface PT_h of the structural member PT may bein direct contact with the upper surface of the first substrate 500. Across section of the structural member PT may have a tapered shape(e.g., a substantially trapezoid shape). The angle between the lateralsurface PT_h of the structural member PT and the upper surface of thefirst substrate 500 may be an obtuse angle.

A plurality of structural members PT may be provided, and each of thestructural members PT may be disposed for one pixel PX. Specifically,the structural member PT may have an island shape, and may be disposedto be adjacent to a thin film transistor in one pixel PX.

For example, the protrusion structural member PT serves to support thesource electrode SE and increase the level of the source electrode SE.The structural member PT may overlap the source electrode SE of thecorresponding pixel PX.

The structural member PT may be made of an inorganic materialcontaining, for example, at least of aluminum oxide (Al₂O₃), siliconnitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiNO)and/or may be made of an organic material having high heat resistance.

The gate electrode GE may be disposed on the structural member PT. Inthis specification, the gate electrode GE and the gate line GL arecollectively referred to as a gate wiring (GL, GE).

The gate line GL may receive and transmit signals for driving thecorresponding transistor. The plurality of gate lines GL may extend in afirst direction, for example, in the x-axis direction of FIG. 2 . Thegate electrode GE may be formed to protrude from the gate line GL, andmay form three terminals of a thin film transistor together with thesource electrode SE and drain electrode DE to be described later.

The gate electrode GE may be disposed to at least partially overlap thestructural member PT. For example, the gate electrode GE may be disposedover the upper surface PT_s of the structural member PT, the lateralsurface PT_h of the structural member PT, and the upper surface of thefirst substrate 500. Specifically, one end of the gate electrode GE maybe disposed to be in contact with the upper surface PT_s of thestructural member PT, and the other end of the gate electrode GE may bedisposed to be in contact with the upper surface of the first substrate500. Further, a part of the gate electrode GE may overlap the structuralmember PT in a horizontal direction. In this specification, “overlap ina vertical direction” or “overlap” means that two or more constituentsat least partially overlap each other when viewed in a directionperpendicular to the upper surface of the first substrate 500, and“overlap in a horizontal direction” means that two or more constituentsat least partially overlap each other when viewed in a directionparallel to the upper surface of the first substrate 500.

From the above viewpoint, the lateral surface PT_h of the structuralmember PT may overlap the gate electrode in a horizontal direction. Apart of the gate electrode GE is disposed along the lateral surface PT_hof the structural member PT, and thus a part of the gate electrode GEmay extend to have the same shape as the lateral surface PT_h of thestructural member PT. In an exemplary embodiment in which the lateralsurface PT_h of the structural member PT has an inclined surface, thegate electrode GE overlapping the inclined surface in a horizontal orvertical direction may include an inclined surface. In this case, thegradient of the inclined surface of the gate electrode GE may besubstantially equal to the gradient of the lateral surface PT_h of thestructural member PT. In this case, one end of the gate electrode GE maybe disposed on the upper surface of the structural member PT, and theother end of the gate electrode GE may be disposed on the upper surfaceof the first substrate 500. In an embodiment, the other end of the gateelectrode GE may be directly in contact with the supper surface of thefirst substrate 500.

A gate insulation film GI may be disposed on the first substrate 500,the structural member PT, and the gate electrode GE. The gate insulationfilm GI may be formed on the entire first substrate 500 to cover thefirst substrate 500, the structural member PT, and the gate electrodeGE.

The gate insulation film GI may be made of at least one of inorganicinsulating materials, such as silicon oxide (SiOx) and silicon nitride(SiNx), and organic insulating materials, such as benzocyclobutene(BCB), acrylic materials, and polyimide. However, these materials areillustrative, and the materials of the gate insulation film GI are notlimited thereto.

The portion of the gate insulation film GI, this portion overlapping thelateral surface PT_h of the structural member PT in a horizontal orvertical direction, may be disposed along the shape of the lateralsurface PT_h of the structural member PT. For example, when the lateralsurface PT_h of the structural member PT has an inclined surface, thegate insulation film GI overlapping the this inclined surface mayinclude an inclined surface disposed along the inclined surface of thelateral surface PT_h of the structural member PT.

The semiconductor member 700 may be disposed on the gate insulating filmGI. The semiconductor member 700 may be disposed to at least partiallyoverlap the source electrode SE and/or drain electrode DE to bedescribed later.

The semiconductor member 700 may have an island shape, and may bedisposed to entirely overlap the gate electrode GE. In an embodiment,only a part of the semiconductor member 700 may overlap the gateelectrode GE.

An ohmic contact layer (not shown) doped with n-type impurities may bedisposed on the semiconductor member 700. The ohmic contact layer mayoverlap the semiconductor member 700 entirely or partially. The ohmiccontact lay may not be provided.

When the semiconductor member 700 is made of an oxide semiconductor, thesemiconductor member 700 may contain zinc oxide (ZnO). In addition, thesemiconductor member 700 may be doped with ions of one or more selectedfrom gallium (Ga), indium (In), tin (Sn), zirconium (Zr), hafnium (Hf),cadmium (Cd), silver (Ag), copper (Cu), germanium (Ge), gadolinium (Gd),titanium (Ti), and vanadium (V). For example, the semiconductor member700, which is made of an oxide semiconductor, may contain at least oneof ZnO, ZnGaO, ZnInO, ZnSnO, GaInZnO, CdO, InO, GaO, SnO, AgO, CuO, GeO,GdO, HfO, TiZnO, InGaZnO, and InTiZnO.

In an embodiment, the semiconductor member 700 may contain alow-temperature polycrystalline silicon (LTPS) semiconductor. That is,the present invention is not limited by the kind of semiconductorscontained in the semiconductor member 700, and various kinds ofsemiconductors, which is currently used or will be used in the futurewith the development of technology, can be applied to the semiconductormember 700.

The semiconductor member 700 may be formed to be conformal with the gateelectrode GE. Specifically explaining this configuration, one end of thesemiconductor member 700 may overlap the upper surface PT_s of thestructural member PT, and the other end thereof may not overlap theupper surface PT_s of the structural member PT. The semiconductor member700 may be formed on the gate insulation film GI overlapping the uppersurface PT_s and lateral surface PT_h of the structural member PT, andthus the semiconductor member 700 may be disposed along the inclinedsurface formed by the lateral surface PT_h of the structural member PTand the gate insulating film GI. That is, a part of the semiconductormember 700 may overlap the lateral surface PT_h of the structural memberPT in a horizontal direction.

A data wiring (DL, SE, DE) may be disposed on the gate insulation filmGI and the semiconductor member 700. The data wiring may include a dataline DL, a source electrode SE, and a drain electrode DE. The data lineDL may extend in a second direction, that is, in the y-axis direction ofFIG. 2 , to cross a gate line GL.

The source electrode SE may be branched from the data line DL to extendto the upper portion of the semiconductor member 700, and the drainelectrode DE may be disposed to be spaced apart from each other and faceeach other.

For example, the array substrate according to an embodiment may have abottom gate structure in which the source electrode SE and the drainelectrode DE are disposed over the gate electrode GE.

The data wiring (DL, SE, DE) may have a single-layer structure ormulti-layer structure and may be made of one or more metals and/or oneor more alloys, such as one or more of nickel (Ni), cobalt (Co),titanium (Ti), silver (Ag), copper (Cu), molybdenum (Mo), aluminum (Al),beryllium (Be), niobium (Nb), gold (Au), iron (Fe), selenium (Se),tantalum (Ta), etc. and/or one or more alloys of some of titanium (Ti),zirconium (Zr), tungsten (W), tantalum (Ta), niobium (Nb), platinum(Pt), hafnium (Hf), etc. The data wiring may include one or more ofoxygen (O), nitrogen (N), etc.

At least a part of the data wiring (DL, SE, and DE) may be disposed onthe structural member PT.

FIG. 3 illustrates a case where the data line DL and the sourceelectrode SE are formed over the structural member PT. That is, in theembodiment of FIG. 3 , at least a part of the data line DL and thesource electrode SE may overlap the upper surface PT_s of the structuralmember PT, and the drain electrode DE may not overlap the upper surfacePT_s of the structural member PT. In other words, the lowermost surfaceof the data line DL and the source electrode SE may be located at a highposition compared to the lowermost surface of the drain electrode DE.That is, the lowermost surface of the data line DL and the sourceelectrode SE is located at a level different from the lowermost surfaceof the drain electrode DE. In this specification, the “lowermostsurface” of an electrode refers to a surface located at the lowestposition of lower surfaces of the electrode and/or an extending surfacethereof. Further, the “level” refers to a height from the upper surfaceof the first substrate 500 to a predetermined plane.

One end of the source electrode SE and one end of the drain electrode DEmay overlap the semiconductor member 700. Explaining this from theviewpoint of the semiconductor member 700, one end of the semiconductormember 700 may overlap the source electrode SE, and the other endthereof may overlap the drain electrode DE.

The source electrode SE and the drain electrode DE are disposed atdifferent levels and respectively contact different semiconductor endportions of the semiconductor member 700. Thus, the horizontal area ofthe semiconductor member 700 may be relatively small compared to whenthe source electrode SE and the drain electrode DE are located at thesame level. Therefore, the horizontal area of a thin film transistor inone pixel may be minimized, and thus the aperture ratio of pixels may bemaximized.

Further, when the portion of the semiconductor member 700 disposedbetween the source electrode SE and the drain electrode DE is disposedalong the inclined surface formed by the structural member PT, thechannel Ch of the semiconductor member 700 may be formed along theinclined surface. That is, the channel Ch may be formed between thesource electrode SE overlapping one end of the semiconductor member 700and the drain electrode DE overlapping the other end of thesemiconductor member 700. In this case, the channel Ch can secure asufficient length along the inclined surface, and thus it is possible toimplement a thin film transistor having stable electricalcharacteristics.

A passivation film 600 may be disposed on the gate insulation film GI,the data line DL, the source electrode SE, the semiconductor member 700,and the drain electrode DE. The passivation film 600, which is aplanarization film, is formed over the entire first substrate 500 tocover the data line DL, the source electrode SE, the semiconductormember 700, and the drain electrode DE. The passivation film 600 may bemade of an organic insulating material or an inorganic insulatingmaterial.

The passivation film 600 may be provided with a first contact hole CNT1.The first contact hole CNT1 penetrates the passivation film 600 to atleast partially expose the surface of the drain electrode DE.

A pixel electrode PE may be disposed on the passivation film 600. Thepixel electrode PE may be electrically connected with the drainelectrode DE through the first contact hole CNT1 penetrating thepassivation film 600.

The pixel electrode PE may be made of a transparent conductor, such asindium tin oxide (ITO) or indium zinc oxide (IZO), or a reflectiveconductor, such as aluminum.

FIG. 2 illustrates a case of the pixel electrode PE having a flat plateshape, but the shape of the pixel electrode PE is not limited thereto.In an embodiment, the pixel electrode PE may be a structure having oneor more slits. In an embodiment, one pixel may be provided with one ormore pixel electrodes, and, in this case, voltages different from eachother may be applied to the plurality of pixel electrodes.

FIG. 4 is a cross-sectional view of an array substrate according to anembodiment.

Referring to FIG. 4 , the array substrate according to an embodiment isdifferent from the array substrate according to the embodiment of FIG. 3in that one end of the semiconductor member 700 is in contact with thelower surface of the source electrode SE, and the other end of thesemiconductor member 700 is in contact with the upper surface of thedrain electrode DE.

Specifically, one end of the semiconductor member 700 may be disposedbeneath the source electrode SE, and the other end thereof may bedisposed on the drain electrode DE. This configuration may be due to themethod of forming a source drain SE, a drain electrode DE and asemiconductor member 700, in which the drain electrode DE is firstformed, the semiconductor member 700 is formed, and then the sourceelectrode SE. That is, this configuration may be due to the method ofsequentially forming the drain electrode DE-semiconductor member700-source electrode SE. However, this configuration is set forth toillustrate the present invention, and the scope is not limited by such aprocess sequence.

Like this, when one end of the semiconductor member 700 is disposedbeneath the source electrode SE and the other end thereof is disposed onthe drain electrode DE, it is possible to secure a relatively longchannel length compared to the channel length in the embodiment of FIG.3 . That is, a sufficient channel length necessary for driving a thinfilm transistor can be secured, thereby implementing a thin filmtransistor having excellent electrical characteristics.

FIG. 5 is a cross-sectional view of an array substrate according to anembodiment.

Referring to FIG. 5 , the array substrate according to an embodiment isdifferent from the array substrate according to the embodiment of FIG. 3in that the structural member PT1 has a substantially parallelepipedshape (e.g., a substantially rectangular cuboid shape).

The structural member PT1 may have a parallelepiped shape (e.g., asubstantially rectangular cuboid shape). A cross section of thestructural member PT1 may have a substantially rectangular shape. Inthis case, the angle between the lateral surface PT1_h of the structuralmember PT1 and the upper surface of the first substrate 500 may be asubstantially right angle (01).

When the angle between the lateral surface PT1_h of the structuralmember PT1 and the upper surface of the first substrate 500 is asubstantially right angle, a part of the gate electrode GE disposedalong the lateral surface PT1_h of the structural member PT1 may extendin a direction perpendicular to the upper surface of the first substrate500. Thus, a part of the semiconductor member 700 may also extend in adirection perpendicular to the upper surface of the first substrate 500.That is, the semiconductor member 700, the gate electrode GE, and thelateral surface PT1_h of the structural member PT1 may overlap in ahorizontal direction.

Accordingly, a part of the channel Ch formed between the sourceelectrode SE and the drain electrode DE may extend in a horizontaldirection.

FIG. 6 is a cross-sectional view of an array substrate according to anembodiment.

Referring to FIG. 6 , the array substrate according to an embodiment isdifferent from the array substrate according to the embodiment of FIG. 3in that a cross section of the structural member PT2 has an inversetapered shape (e.g., a substantially trapezoid shape with a relativelyshort side positioned between the substrate and a relatively long side).

The cross-section of the structural member PT2 may have an inversetapered shape. In other words, the angle between the lateral surfacePT2_h of the structural member PT2 and the upper surface of the firstsubstrate 500 may be an acute angle (02). In this case, the outer sideof the upper surface PT2_s of the structural member PT2 may be disposedrelatively outward compared to the outer side of the lower surface ofthe structural member PT2.

When the cross section of the structural member PT2 has an inversetapered shape, a cross-section of the gate electrode GE (in contact withthe lateral surface PT2_h of the structural member PT2) may have a Zshape. Accordingly, a cross section of a part of the semiconductormember 700 disposed adjacent to the gate electrode GE may also havetapered Z shape corresponding to the shape of the gate electrode GE.

FIG. 7 is a plan view of an array substrate according to an embodiment.FIG. 8 is a cross-sectional view taken along the line II-IF of FIG. 7 .

Referring to FIGS. 7 and 8 , the array substrate according to anembodiment is different from the array substrate according to theembodiment of FIG. 2 in that the gate electrode GE is disposed over thesource electrode SE and the drain electrode DE.

The array substrate according to an embodiment may have a top gatestructure.

Specifically explaining this configuration, the semiconductor member 700may be formed on the structural member PT.

FIG. 7 shows the first pixel PX1 and second pixel PX2 adjacent to eachother.

However, since the first pixel PX1 and the second pixel PX2 havesubstantially the same shape in the embodiment of FIG. 7 , descriptionof the first pixels (PX1) may be substantially applicable to the secondpixels (PX2).

The semiconductor member 700 may be disposed to at least partiallyoverlap the structural member PT. The semiconductor member 700 may bedisposed over the upper surface PT_s of the structural member PT, thelateral surface PT_h of the structural member PT, and the upper surfaceof the first substrate 500. In other words, one end of the semiconductormember 700 may be in contact with the upper surface PT_s of thestructural member PT, and the other end of the semiconductor member 700may be in contact with the upper surface of the first substrate 500.Further, a part of the semiconductor member 700 may overlap thestructural member PT in a horizontal direction.

Specifically, the lateral surface PT_h of the structural member PT mayoverlap the semiconductor member 700 in a horizontal direction. A partof the semiconductor member 700 is disposed along the lateral surfacePT_h of the structural member PT, and thus a part of the semiconductormember 700 may extend to have the same shape as the lateral surface PT_hof the structural member PT. That is, in an exemplary embodiment inwhich the lateral surface PT_h of the structural member PT has aninclined surface, the semiconductor member 700 overlapping the inclinedsurface in a horizontal or vertical direction may include an inclinedsurface. In this case, the gradient of the inclined surface of thesemiconductor member 700 may be substantially equal to the gradient ofthe lateral surface PT_h of the structural member PT.

A data wiring (DL, SE, and DE) may be disposed on the semiconductormember 700, the structural member PT, and the first substrate 500. Atleast a part of the data wiring (DL, SE, and DE) may be disposed on thestructural member PT. FIG. 8 illustrates a case of the data line DL andthe source electrode SE being formed on the structural member PT. Thatis, in the embodiment of FIG. 8 , at least a part of the data line DLand the source electrode SE may overlap the upper surface PT_s of thestructural member PT, and the drain electrode DE may not overlap theupper surface PT_s of the structural member PT.

In other words, even in this case, the lowermost surface of the dataline DL and the source electrode SE may be located at a high positioncompared to the lowermost surface of the drain electrode DE. That is,the lowermost surface of the data line DL and the lower most surface ofthe source electrode SE are located at a level different from thelowermost surface of the drain electrode DE.

One end of the source electrode SE and one end of the drain electrode DEmay overlap the semiconductor member 700. Explaining this configurationfrom the viewpoint of the semiconductor member 700, one end of thesemiconductor member 700 may overlap the source electrode SE, and theother end thereof may overlap the drain electrode DE.

The source electrode SE and the drain electrode DE may be disposed atdifferent levels and may contact different semiconductor end portions ofthe semiconductor member 700. Thus, the horizontal area of thesemiconductor member 700 may be relatively small compared to when thesource electrode SE and the drain electrode DE are located at the samelevel. Therefore, the horizontal area of a thin film transistor in onepixel may be minimized, and thus the aperture ratio of pixels may bemaximized.

The gate insulation film GI may be disposed on the first substrate 500,the structural member PT, the source electrode SE, the semiconductormember 700, and the drain electrode DE. The gate insulation film GE maybe formed on the entire first substrate 500 to cover the first substrate500, the structural member PT, the source electrode SE, thesemiconductor member 700, and the drain electrode DE.

The gate electrode GE may be formed on the gate insulation film GI. Thegate electrode GE may be disposed adjacent to the semiconductor member700. Specifically, the gate electrode GE may overlap the semiconductormember 700 in a vertical direction. The gate electrode GE may be formedto be conformal with the semiconductor member 700. Specificallyexplaining this configuration, one end of the gate electrode GE mayoverlap the upper surface PT_s of the structural member PT, and theother end of the gate electrode GE may not overlap the upper surfacePT_s of the structural member PT.

Further, one end of the gate electrode GE may overlap the sourceelectrode SE, and the other end of the gate electrode GE may overlap thedrain electrode DE. That is, the gate electrode GE may be disposed alongthe inclined surface formed by the lateral surface PT_h of thestructural member PT and the gate insulation film GI formed on thelateral surface PT_h thereof, and thus a part of the gate electrode GEmay include an inclined surface. In this case, the gradient of theinclined surface of the gate electrode GE may be substantially equal tothe gradient of the inclined surface of the lateral surface PT_h of thestructural member PT. In this case, the gate electrode GE may overlapthe lateral surface PT_h of the structural member PT in a horizontaldirection.

When the semiconductor member 700 disposed between the source electrodeSE and the drain electrode DE is disposed along the inclined surfaceformed by the structural member PT, the channel Ch of the semiconductormember 700 may be formed along the inclined surface. That is, thechannel Ch may be formed between the source electrode SE overlapping oneend of the semiconductor member 700 and the drain electrode DEoverlapping the other end of the semiconductor member 700. In this case,the channel Ch can secure a sufficient length along the inclinedsurface, and thus it is possible to implement a thin film transistorhaving stable electrical characteristics.

The passivation film 600 may be disposed on the gate insulation film GIand the gate electrode GE. Since the passivation film 600 issubstantially the same as those having been described in the arraysubstrates according to some embodiments, detailed description thereofwill be omitted.

A second contact hole CNT2 may be disposed in the passivation film 600.Specifically, the second contact hole CNT2 penetrates the passivationfilm 600 and the gate insulation film GI to at least partially exposethe surface of the drain electrode DE.

The pixel electrode PE may be disposed on the second contact hole CNT2.The pixel electrode PE may be electrically connected with the drainelectrode DE through the second contact hole CNT1.

FIG. 9 is a plan view of an array substrate according to an embodiment.FIG. 10 is a cross-sectional view taken along the line III-III′ of FIG.9 .

Referring to FIGS. 9 and 10 , the array substrate according to anembodiment includes a first substrate 500, a first pixel electrode PX1and a second pixel electrode PX2 disposed on the first substrate 500 tobe adjacent to each other, and a structural member PT3 including anupper surface PT3_s projected from the upper surface of the firstsubstrate 500 and a lateral surface PT3_h extending from the uppersurface PT3_s toward the upper surface of the first substrate 500. Here,the first pixel PX1 includes a first gate electrode GE1 disposed on thestructural member PT3, a first source electrode SE1 and a first drainelectrode DE1 insulated from the first gate electrode GE1 and disposedto be spaced apart from each other, and a first semiconductor member 700a disposed between the first source electrode SE1 and the first drainelectrode DEL The second pixel PX2 includes a second gate electrode GE1disposed on the structural member PT3, a second source electrode SE2 anda second drain electrode DE2 insulated from the second gate electrodeGE2 and disposed to be spaced apart from each other, and a secondsemiconductor member 700 b disposed between the second source electrodeSE2 and the second drain electrode DE2. Any one selected from the firstsource electrode SE1 and the first drain electrode DE1 and any oneselected from the second source electrode SE2 and the second drainelectrode DE2 are disposed on the upper surface PT3_s of the structuralmember PT3.

The structural member PT3 may be disposed over the first pixel PX1 andthe second pixel PX2. In other words, the first pixel PX1 and the secondpixel PX2 may share one structural member PT3.

For the convenience of explanation, the data line included in the firstpixel PX1 is referred to as a first data line DL1, the gate electrodeincluded in the first pixel PX1 is referred to as a first gate electrodeGE1, the source electrode included in the first pixel PX1 is referred toas a first source electrode SE1, the drain electrode included in thefirst pixel PX1 is referred to as a first drain electrode DE1, and thesemiconductor member included in the first pixel PX1 is referred to as afirst semiconductor member 700 a.

Similarly to this, the data line included in the second pixel PX2 isreferred to as a second data line DL2, the gate electrode included inthe second pixel PX2 is referred to as a second gate electrode GE2, thesource electrode included in the second pixel PX2 is referred to as asecond source electrode SE2, the drain electrode included in the secondpixel PX2 is referred to as a second drain electrode DE2, and thesemiconductor member included in the second pixel PX2 is referred to asa second semiconductor member 700 b.

Based on this, explaining the array substrate according to anembodiment, the structural member PT3 may be disposed on the firstsubstrate 500. The structural member PT3 may be disposed over the firstpixel PX1 and the second pixel PX2. Specifically, one side of thestructural member PT3 may be disposed on the first pixel PX1, and theother side of the structural member PT3 may be disposed on the secondpixel PX2.

The structural member PT3 may include an upper surface PT3_s projectedfrom the upper surface of the first substrate 500 at a predetermineddistance, a first lateral surface PT3_h 1 extending from one side of theupper surface PT3_s toward the upper surface of the first substrate 500,and a second lateral surface PT3_h 2 extending from the other side ofthe upper surface PT3_s toward the upper surface of the first substrate500.

The first gate electrode GE1 may be disposed on the first lateralsurface PT3_h 1, and the second gate electrode GE2 may be disposed onthe second lateral surface PT3_h 2. Each of the first gate electrode GE1and the second gate electrode GE2 may at least partially overlap thestructural member PT. Specifically, the first gate electrode GE1 may bedisposed over the upper surface of the first substrate 500, the firstlateral surface PT3_h 1 of the structural member PT, and the uppersurface PT3_s of the structural member PT. Similarly to this, the secondgate electrode GE2 may be disposed over the upper surface of the firstsubstrate 500, the second lateral surface PT3_h 2 of the structuralmember PT, and the upper surface PT3_s of the structural member PT.

In other words, one end of the first gate electrode GE1 may overlap theupper surface PT3_s of the structural member PT, and the other end ofthe first gate electrode GE1 may not overlap the upper surface PT3_s ofthe structural member PT. Similarly to this, one end of the second gateelectrode GE2 may overlap the upper surface PT3_s of the structuralmember PT, and the other end of the second gate electrode GE1 may notoverlap the upper surface PT3_s of the structural member PT.

Specifically, the first lateral surface PT3_h 1 and second lateralsurface PT3_h 2 of the structural member PT may overlap the first gateelectrode GE1 and the second gate electrode GE2, respectively. A part ofthe first gate electrode GE1 and a part of the second gate electrode GE2may be disposed along the first lateral surface PT3_h 1 and secondlateral surface PT3_h 2 of the structural member PT, respectively, andthus may extend to have the same shape as the first lateral surfacePT3_h 1 and second lateral surface PT3_h 2 of the structural member PT.In an exemplary example in which each of the first lateral surface PT3_h1 and the second lateral surface PT3_h 2 has an inclined surface, eachof the first gate electrode GE1 and second gate electrode GE2overlapping the inclined surface in a horizontal or vertical directionmay have an inclined surface. In this case, the gradient of the inclinedsurface of each of the first gate electrode GE1 and second gateelectrode GE2 may be substantially equal to the gradient of the inclinedsurface of each of the first lateral surface PT3_h 1 and the secondlateral surface PT3_h 2.

A gate insulation film GI may be disposed on the first substrate 500,the structural member PT3, the first gate electrode GE1, and the secondgate electrode GE2. The gate insulation film GI may be formed on theentire first substrate 500 to cover the first substrate 500, thestructural member PT3, the first gate electrode GE1, and the second gateelectrode GE2.

The gate insulation film GI may be made of at least one inorganicinsulating material, such as silicon oxide (SiOx) and/or silicon nitride(SiNx), and/or one or more organic insulating materials, such as one ormore of benzocyclobutene (BCB), acrylic materials, and polyimide.However, these materials are illustrative, and the materials of the gateinsulation film GI are not limited thereto.

A portion which horizontally or vertically overlaps the first lateralsurface PT3_h 1 and the second lateral surface PT3_h 2 of the structuralmember PT3 in the gate insulation film GI may be disposed along theshape of the first lateral surface PT3_h 1 and the second lateralsurface PT3_h 2 of the structural member PT3. Each of the first lateralsurface PT3_h 1 and the second lateral surface PT3_h 2 of the structuralmember PT3 may include an inclined surface, and the gate insulation filmGI (overlapping the inclined surfaces of the structural member PT3) mayinclude inclined surfaces disposed along the inclined surfaces of thefirst lateral surface PT3_h 1 and the second lateral surface PT3_h 2 ofthe structural member PT3.

First and second semiconductor members 700 a and 700 b may be disposedon the gate insulation film GI. The semiconductor member 700 may bedisposed to at least partially overlap first and second sourceelectrodes SE1 and SE2 and/or first and second drain electrodes DE1 andDE2 to be described later.

The first and second semiconductor members 700 a and 700 b may be formedon the gate insulation film GI, which overlaps the upper surface PT3_s,the first lateral surface PT3_h 1, and the second lateral surface PT3_h2 of the structural member PT3. Accordingly, the first semiconductormember 700 a may be disposed along the inclined surface formed by thefirst lateral surface PT3_h 1 of the structural member PT3 and the gateinsulation film GI. Similarly to this, the second semiconductor member700 b may be disposed along the inclined surface formed by the secondlateral surface PT3_h 2 of the structural member PT3 and the gateinsulation film GI.

Accordingly, a part of the first and second semiconductor members 700 aand 700 b may overlap the first lateral surface PT3_h 1 and the secondlateral surface PT3_h 2 of the structural member PT3 in a horizontaldirection.

In a first pixel PX1, on the gate insulation film GI and the firstsemiconductor member 700 a, a first data line DL, a first sourceelectrode SE1, and a first drain electrode DE1 may be disposed.

At least one of the first data line DL, the first source electrode SE1,and the first drain electrode DE1 may be disposed on the upper surfacePT3_h of the structural member PT3.

FIG. 10 illustrates a case where the first drain electrode DE1 is formedon the structural member PT3. That is, in an embodiment of FIG. 10 , atleast a part of the first drain electrode DE1 at least partiallyoverlaps the upper surface PT3_h of the structural member PT3, and thefirst data line DL and the first source electrode SE1 may not overlapthe upper surface PT3_h of the structural member PT3.

In other words, the lowermost surface of the first data line DL1 and thefirst source electrode SE1 may be located at a low position compared tothe lowermost surface of the first drain electrode DEL That is, thelowermost surface of the first data line DL1 and the first sourceelectrode SE1 may be located at a level different from the lowermostsurface of the first drain electrode DEL In this specification, the“lowermost surface” of an electrode refers to a surface located at thelowest position of lower surfaces of the electrode and/or an extendingsurface thereof.

In a second pixel PX1, on the gate insulation film GI and the secondsemiconductor member 700 b, a second data line DL2, a second sourceelectrode SE2, and a second drain electrode DE2 may be disposed.

At least one of the second data line DL2, the second source electrodeSE2, and the second drain electrode DE2 may be disposed on the uppersurface PT3_h of the structural member PT3.

FIG. 10 illustrates a case where the second data line DL2 and the secondsource electrode SE2 are formed on the upper surface PT3_h of thestructural member PT3. That is, unlike the first pixel PX1, in thesecond pixel PX2, a part of the second data line DL2 and the secondsource electrode SE2 is disposed on the upper surface PT3_h of thestructural member PT3. That is, in the embodiment of FIG. 10 , at leasta part of the second data line DL2 and the second source electrode SE2at least partially overlaps the upper surface PT3_h of the structuralmember PT3, and the second drain electrode DE2 may not overlap the uppersurface PT3_h of the structural member PT3.

In other words, the lowermost surface of the second data line DL2 andthe second source electrode SE2 may be located at a high positioncompared to the lowermost surface of the second drain electrode DE2.That is, the lowermost surface of the second data line DL2 and thesecond source electrode SE2 may be located at a level different from thelowermost surface of the second drain electrode DE2.

In this case, the first data line DL1 and the second data line DL2 maybe disposed on different levels. Illustratively, the first data line DL1may be positioned at a relatively high level compared to the second dataline DL2.

One end of the first source electrode SE1 and one end of the first drainelectrode DE1 may overlap the first semiconductor member 700 a. Whendescribing this in terms of the first semiconductor member 700 a, oneend of the first semiconductor member 700 a overlaps the first sourceelectrode SE1 and the other end thereof may overlap the first drainelectrode DE1.

Similarly to this, one end of the second source electrode SE2 and oneend of the second drain electrode DE2 may overlap the secondsemiconductor member 700 b. When describing this in terms of the secondsemiconductor member 700 b, one end of the second semiconductor member700 b overlaps the second source electrode SE2 and the other end thereofmay overlap the second drain electrode DE2.

As such, when the first pixel PX1 and the second pixel PX2 share thestructural member PT3, in the first pixel PX1 and the second pixel PX2,the horizontal area of the thin film transistors may be decreased. Thatis, the thin film transistor may be disposed by using a relatively smallhorizontal area. Thus, the aperture ratio of each pixel may berelatively increased.

A passivation film 600 may be disposed on the gate insulation film GI,the first and second data lines DL1 and DL2, the first and second sourceelectrodes SE1 and SE2, the first and second semiconductor members 700 aand 700 b, and the first and second drain electrodes DE 1 and DE2.

The passivation film 600, which is a planarization film, covers the gateinsulation film GI, the first and second data lines DL1 and DL2, thefirst and second source electrodes SE1 and SE2, the first and secondsemiconductor members 700 a and 700 b, and the first and second drainelectrodes DE 1 and DE2 and may be entirely formed on the firstsubstrate 500. The passivation film 600 may be made of an organicinsulating material or an inorganic insulating material.

On the first pixel PX1 and the second pixel PX2, a third contact holeCNT3 and a fourth contact hole CNT4 may be disposed, respectively. Thethird contact hole CNT3 and the fourth contact hole CNT4 may at leastpartially expose the surface of the first and second drain electrodes DE1 and DE2 through the passivation film 600.

In an embodiment, the third contact hole CNT3 may be disposed on thestructural member PT3. That is, the third contact hole CNT3 may overlapthe structural member PT3. In this case, a vertical depth of the thirdcontact hole CNT3 may be smaller than a vertical depth of the fourthcontact hole CNT4. In other words, a level of the lowermost surface ofthe third contact hole CNT3 may be higher than a level of the lowermostsurface of the fourth contact hole CNT4.

First and second pixel electrodes PE1 and PE2 may be disposed on thepassivation film 600.

The first and second pixel electrodes PE1 and PE2 may be electricallyconnected with the drain electrode DE through the first contact holeCNT1 penetrating the passivation film 600.

In this case, due to a level difference between the first drainelectrode DE1 and the second drain electrode DE2, a contact surfacebetween the first pixel electrode PE1 and the first drain electrode DE1may be located at a relatively high portion compared to a contactsurface between the second pixel electrode PE2 and the second drainelectrode DE2. That is, the contact surface between the first pixelelectrode PE1 and the first drain electrode DE1 may be located on ahigher level than the contact surface between the second pixel electrodePE2 and the second drain electrode DE2.

FIG. 11 is a plan view of an array substrate according to an embodiment.FIG. 12 is a cross-sectional view taken along line IV-IV of FIG. 11 .

Referring to FIGS. 11 and 12 , the array substrate according to anembodiment is different from the embodiment of FIG. 10 in that the firstpixel electrode PE1 and the second pixel electrode PE2 are substantiallysymmetrical to each other with reference to a combination of the firstdata line DL1 and the second data line DL2.

Illustratively, the first data line DL1 and the second data line DL2 maybe disposed to be adjacent to each other. In this case, the first pixelPX1 and the second pixel PX2 may have a symmetrical shape.

Specifically, a part of the first data line DL1 and the second data lineDL2 may be disposed on the upper surface PT3_s of the structural memberPT3. That is, the first data line DL1 and the second data line DL2 maybe disposed on the same level.

In addition, the first pixel PX1 and the second pixel PX2 may besymmetrical to each other on the same level.

Further, the first data line DL1 of the first pixel PX1, the first gateelectrode GE1, the first source electrode SE1, the first drain electrodeDE1, and the first semiconductor member 700 a may be symmetrical to thesecond data line DL2 of the second pixel PX2, the second gate electrodeGE2, the second source electrode SE2, the second drain electrode DE2,and the second semiconductor member 700 a.

On the first pixel PX1 and the second pixel PX2, a fifth contact holeCNT5 and a sixth contact hole CNT6 may be disposed, respectively. Thefifth contact hole CNT5 and the sixth contact hole CNT6 may at leastpartially expose the surface of the first and second drain electrodesDE1 and DE2 through the passivation film 600.

The fifth contact hole CNT5 and the sixth contact hole CNT6 may besubstantially symmetrical to each other with reference to the structuralmember PT. Further, the vertical depths of the fifth contact hole CNT5and the sixth contact hole CNT6 may be the same as each other.

FIG. 13 is a plan view of an array substrate according to an embodiment.FIG. 14 is a cross-sectional view taken along line V-V of FIG. 13 .

Referring to FIGS. 13 and 14 , the array substrate according to anembodiment is different from the embodiment of FIG. 12 in that thestructural member PT3 is disposed over the first pixel PX1 and thesecond pixel PX2, and the first pixel PX1 and the second pixel PX2 havea top gate type.

As described above, the array substrates according to some embodimentsmay have a top gate structure. In the embodiment of FIG. 13 , thestructural member PT3 may be substantially the same as the structuralmember PT3 described in FIG. 12 . Accordingly, a detailed descriptionthereof will be omitted.

Further, the top gate structure of the first pixel PX1 may besubstantially the same as the top gate structure described in FIG. 8 .Accordingly, a detailed description thereof will be omitted.

Further, a part of the first data line DL1 and the second data line DL2may be disposed on the upper surface PT3_s of the structural member PT3.That is, the first data line DL1 and the second data line DL2 may bedisposed on the same level.

In addition, the first pixel PX1 and the second pixel PX2 may besymmetrical to each other on the same level.

Further, the first data line DL1 of the first pixel PX1, the first gateelectrode GE1, the first source electrode SE1, the first drain electrodeDE1, and the first semiconductor member 700 a may be substantiallysymmetrical and/or analogous to the second data line DL2 of the secondpixel PX2, the second gate electrode GE2, the second source electrodeSE2, the second drain electrode DE2, and the second semiconductor member700 a.

That is, the embodiment of FIG. 12 is different from the embodiment ofFIG. 11 in that the thin film transistors of the first pixel PX1 and thesecond pixel PX2 have the top gate structure.

In addition, FIG. 12 illustrates a case where the first data line DL1and the second data line DL2 are disposed on the same level. In anembodiment, as illustrated in FIG. 10 , the first data line DL1 and thesecond data line DL2 may be disposed on different levels.

FIG. 15 is a cross-sectional view of a liquid crystal display deviceaccording to an embodiment.

Referring to FIG. 15 , a liquid crystal display device according to anembodiment includes a first substrate 500, a structural member PT thatis disposed on the first substrate 500 and includes an upper surfacePT_s projected from the upper surface of the first substrate 500 and alateral surface extended from the upper surface PT_s toward the uppersurface of the first substrate 500, a gate electrode GE disposed on thestructural member PT, a source electrode SE and a drain electrode DEinsulated from the gate electrode GE and space apart from each other, asemiconductor member 700 disposed between the source electrode SE andthe drain electrode DE, and a second substrate 1000 facing the firstsubstrate 500.

The first substrate 500, the structural member PT that is disposed onthe first substrate 500 and includes the upper surface PT_s projectedfrom the upper surface of the first substrate 500 and the lateralsurface extended from the upper surface PT_s toward the upper surface ofthe first substrate 500, the gate electrode GE disposed on thestructural member PT, the source electrode SE and the drain electrode DEinsulated from the gate electrode GE and space apart from each other,and the semiconductor member 700 disposed between the source electrodeSE and the drain electrode DE are substantially the same as thosedescribed in the array substrate according to some embodiments of thepresent invent above. Accordingly, a detailed description thereof willbe omitted.

The second substrate 1000 may be disposed to face the first substrate500.

The second substrate 1000 may be made of a material having heatresistance and transparency. For example, the second substrate 1000 maybe made of transparent glass or plastic.

A black matrix BM and a color filter CF may be disposed on the secondsubstrate 1000. The black matrix BM may serve to suppress light leakagebetween pixels and light interference between adjacent pixels. The blackmatrix BM may be disposed to overlap the source electrode SE, the drainelectrode DE, and the semiconductor member 700 which are disposed on thefirst substrate 500. In addition, the black matrix BM may also cover thedata line DL and/or the gate line GL.

The color filter CF may be disposed to overlap a pixel electrode PE ofeach pixel. The color filter CF may include at least one color filter ofa red color filter, a blue color filter, and a green color filter.

An overcoat OC may be disposed on the color filter CF and the blackmatrix BM. The overcoat OC may be made of an organic or inorganicinsulating material. The overcoat OC may be formed over the entire areaof the second substrate 1000 and serve as a planarization film.

A common electrode CE may be disposed on the overcoat OC. The commonelectrode CE may be a non-membered front electrode. Common voltage maybe applied to the common electrode CE. When different voltages areapplied to the common electrode CE and the pixel electrode PE, aconstant electric field is formed between the common electrode CE andthe pixel electrode PE to control movement of the liquid crystaldisposed between the first substrate 500 and the second substrate 1000.

FIG. 16 is a cross-sectional view of a liquid crystal display deviceaccording to an embodiment.

Referring to FIG. 16 , a liquid crystal display device according to anembodiment is different from the embodiment of FIG. 15 in that the blackmatrix BM and the color filter CF are formed on the first substrate 500.

That is, the liquid crystal display device according to an embodimentmay be a liquid crystal display device having a color filter on array.

Specifically, the color filter CF may be disposed on the pixel electrodePE. The color filter CF may overlap one pixel electrode PE and beextended to a portion with the thin film transistor. The black matrix BMmay be disposed at the remaining portion except for the portion with thethin film transistor. That is, the black matrix BM is extended along thegate line GL and/or the data line DL and may cover the gate line GLand/or the data line DL. Further, the black matrix BM may extend to theportion with the thin film transistor and at least partially cover thethin film transistor. In this case, the black matrix BM and the colorfilter CF may at least partially overlap each other at the portion withthe thin film transistor.

In an embodiment, the array substrate (or transistor structure) isapplied to the liquid crystal display device. In an embodiment the arraysubstrate (or transistor structure) may be applied to an organic lightemitting display device.

FIGS. 17 to 22 are cross-sectional views for describing a method ofmanufacturing an array substrate according to an embodiment.

Referring to FIGS. 17 to 22 , the method of manufacturing the arraysubstrate according to the embodiment includes forming a structuralmember PT including an upper surface PT_s projected from the uppersurface and a lateral surface PT_h extended from the outside of theupper surface PT_s toward the upper surface of the first substrate 500,forming a gate electrode GE on the structural member PT, forming asemiconductor member 700 on the gate electrode GE, and forming a sourceelectrode SE and a drain electrode DE to be insulated from the gateelectrode GE, in which either the source electrode SE or the drainelectrode DE is formed on the upper surface PT_s of the structuralmember PT.

First, referring to FIG. 17 , the forming of the structural member PT onthe first substrate 500 is performed. The structural member PT and thefirst substrate 500 may be substantially the same as those described inthe array substrate according to some embodiments described above.

The structural member PT may be formed by forming and processing atleast one layer by a chemical vapor deposition or sputtering method.Further, when the structural member PT is formed by patterning the atleast one layer, a photolithography process may be applied.

Subsequently, referring to FIG. 18 , the forming of the gate electrodeGE on the structural member PT may be performed. The gate electrode GEmay be formed on a lateral surface PT_h of the structural member PT.Illustratively, the gate electrode GE may be formed over the uppersurface PT_s and the lateral surface PT_h of the structural member PT,and the upper surface of the first substrate 500.

Further, the gate electrode GE may be made of the same material as thegate line GL. In other words, the gate electrode GE and the gate line GLmay be simultaneously obtained by forming and patterning the same metallayer.

The gate electrode GE and the gate line GL may be substantially the sameas the gate electrode of the array substrate according to someembodiments described above, and thus the detailed description thereofwill be omitted.

Subsequently, referring to FIG. 19 , the gate insulation film GI isformed on the first substrate 500, the structural member PT, and thegate electrode GE.

The gate insulation film GI may be formed on the entire first substrate500 to cover the first substrate 500, the structural member PT, and thegate electrode GE. For example, the gate insulation film GI may beformed on the entire first substrate 500 by a method such as chemicalvapor deposition.

The gate insulation film GI may be substantially the same as thosedescribed in the array substrate according to some embodiments describedabove.

Subsequently, the semiconductor member 700 may be formed on the gateinsulation film GI.

The semiconductor member 700 may be formed by depositing and patterninga semiconductor layer on the entire first substrate 500. A dry etchingor wet etching method may be applied by using a photosensitive member asa mask when patterning the semiconductor layer. However, a method offorming the semiconductor member 700 is not limited thereto. Thesemiconductor member 700 may be substantially the same as thesemiconductor member 700 described in the array substrate according tosome embodiments described above.

Subsequently, referring to FIG. 20 , the forming of the data lines DL,DE, and SE to be insulated from the gate electrode GE is performed.

The source electrode SE, the drain electrode DE, and the data line DLmay be formed by depositing and patterning at least one metal layer. Thedeposition of the metal layer may be performed by a method such aschemical vapor deposition or sputtering. The patterning of the metallayer may be performed by an etching process using the photosensitivemember as the mask. The mask may be formed using a photolithographyprocess.

The source electrode SE, the drain electrode DE, and the data line DLmay be substantially the same as those described in the array substrateaccording to some embodiments described above.

That is, an array substrate having a bottom gate structure may bemanufactured by the method of manufacturing the array substrateaccording to the embodiment.

Subsequently, referring to FIG. 21 , the passivation film 600 is formedon the source electrode SE, the drain electrode DE, the data line DL,the first substrate 500, and the gate insulation film GI. Thepassivation film 600 as a planarization film covers the source electrodeSE, the drain electrode DE, the data line DL, the first substrate 500,and the gate insulation film GI and may be formed on the entire firstsubstrate 500. The passivation film 600 may be made of an organicinsulating material or an inorganic insulating material.

Subsequently, the forming of the first contact hole CNT1 on thepassivation film 600 may be performed. The first contact hole CNT1penetrates the passivation film 600 to at least partially expose thesurface of the drain electrode DE.

Subsequently, referring to FIG. 22 , the forming of the pixel electrodePE on the passivation film 600 may be performed. The pixel electrode PEmay be formed by a method of depositing and patterning at least onemetal layer. The deposition of the metal layer may be performed by amethod such as chemical vapor deposition or sputtering. The patterningof the metal layer may be performed by an etching process using thephotosensitive member as the mask. The mask may be formed using aphotolithography process. The pixel electrode PE may be electricallyconnected with the drain electrode DE through the first contact holeCNT1 penetrating the passivation film 600. The pixel electrode PE may bemade of indium tin oxide (ITO) or indium zinc oxide (IZO) as describedabove.

FIGS. 23 to 28 are cross-sectional views illustrating a method ofmanufacturing an array substrate according an embodiment.

Referring to FIGS. 23 to 28 , the method of manufacturing the arraysubstrate according an embodiment is different from the embodiment ofFIGS. 17 to 22 in that the array substrate has a top gate structure.

The method of manufacturing the array substrate according to anembodiment includes forming on a first substrate 500 a structural memberPT including an upper surface PT_s projected from the upper surface anda lateral surface PT_h extended from the outside of the upper surfacePT_s toward the upper surface of the first substrate 500, forming asemiconductor member 700 on the structural member PT, forming a gateelectrode GE on the semiconductor member 700, and forming a sourceelectrode SE and a drain electrode DE to be insulated from the gateelectrode GE, in which either the source electrode SE or the drainelectrode DE is formed on the upper surface of the structural member PT.

First, referring to FIG. 23 , the forming of the structural member PT onthe first substrate 500 is performed. The structural member PT and thefirst substrate 500 may be substantially the same as those described inthe array substrate according to some embodiments described above.

The structural member PT may be formed by forming and processing atleast one layer by a chemical vapor deposition or sputtering method.Further, when the structural member PT is formed by patterning the atleast one layer, a photolithography process may be applied.

Subsequently, referring to FIG. 24 , the semiconductor member 700 isformed on the structural member PT. The semiconductor member 700 may beformed by depositing and patterning a semiconductor layer on the entirefirst substrate 500. A dry etching or wet etching method may be appliedby using a photosensitive member as a mask when patterning thesemiconductor layer. However, a method of forming the semiconductormember 700 is not limited thereto. The semiconductor member 700 may besubstantially the same as the semiconductor member 700 described in thearray substrate according to some embodiments described above.

Subsequently, referring to FIG. 25 , the forming of the data lines DL,DE, and SE on the semiconductor member 700, the first substrate 500, andthe structural member PT is performed. The source electrode SE, thedrain electrode DE, and the data line DL may be formed by depositing andpatterning at least one metal layer. The deposition of the metal layermay be performed by a method such as chemical vapor deposition orsputtering. The patterning of the metal layer may be performed by anetching process using the photosensitive member as the mask. The maskmay be formed using a photolithography process.

The source electrode SE, the drain electrode DE, and the data line DLmay be substantially the same as those described in the array substrateaccording to some embodiments described above.

That is, an array substrate having a top gate structure may bemanufactured by the method of manufacturing the array substrateaccording to the embodiment.

Subsequently, referring to FIG. 26 , the gate insulation film GI isformed on the source electrode SE, the drain electrode DE, the data lineDL, and the first substrate 500. The gate insulation film GI covers thesource electrode SE, the drain electrode DE, and the data line DL andmay be formed on the entire first substrate 500.

Subsequently, the gate electrode GE is formed on the gate insulationfilm GI. The gate insulation film GI may be substantially the same asthe gate insulation film GI described in the array substrate accordingto some embodiments described above. That is, the gate electrode GE maybe made of the same material as the gate line GL. In other words, thegate electrode GE and the gate line GL may be simultaneously obtained byforming and patterning the same metal layer.

Subsequently, referring to FIG. 27 , the passivation film 600 is formedon the gate electrode GE, the first substrate 500, and the gateinsulation film GI. The passivation film 600 as a planarization filmcovers the gate electrode GE, the first substrate 500, and the gateinsulation film GI and may be formed on the entire first substrate 500.The passivation film 600 may be made of an organic insulating materialor an inorganic insulating material.

Subsequently, the forming of the second contact hole CNT2 on thepassivation film 600 may be performed. The second contact hole CNT2penetrates the passivation film 600 and the gate insulation film GI toat least partially expose the surface of the drain electrode DE.

Subsequently, referring to FIG. 28 , the forming of the pixel electrodePE on the passivation film 600 may be performed. The pixel electrode PEmay be formed by a method of depositing and patterning at least onemetal layer. The deposition of the metal layer may be performed by amethod such as chemical vapor deposition or sputtering. The patterningof the metal layer may be performed by an etching process using thephotosensitive member as the mask. The mask may be formed using aphotolithography process. The pixel electrode PE may be electricallyconnected with the drain electrode DE through the second contact holeCNT2 penetrating the passivation film 600 and the gate insulation filmGI. The pixel electrode PE may be made of indium tin oxide (ITO) orindium zinc oxide (IZO).

While embodiments have been illustrated and described, it will beunderstood by those of ordinary skill in the art that various changes inform and detail may be made without departing from the spirit and scopedefined by the following claims. The described embodiments should beconsidered in an illustrative sense and not for purposes of limitation.

What is claimed is:
 1. A display device, comprising: a substrate; astructural member disposed on the substrate, and including a first sidesurface, a second side surface, and a top surface which is disposedbetween the first side surface and the second side surface; a first gateelectrode disposed on the first side surface and the top surface of thestructural member; an insulating film disposed on the first gateelectrode and the top surface of the structural member; a firstelectrode disposed on the insulating film; a second electrode disposedon the insulating film and spaced apart from the first electrode; afirst semiconductor member disposed on the insulating film, and whichcomprises a first semiconductor portion directly contacting the firstelectrode, a second semiconductor portion directly contacting the secondelectrode, and a third semiconductor portion; a fourth electrodedisposed on the insulating film; a fifth electrode spaced apart from thefourth electrode; and a second semiconductor member disposed on theinsulating film, and which comprises a fourth semiconductor portiondirectly contacting the fourth electrode, a fifth semiconductor portiondirectly contacting the fifth electrode, and a sixth semiconductorportion, wherein the first semiconductor portion and the secondsemiconductor portion are directly connected through the thirdsemiconductor portion, wherein the fourth semiconductor portion and thefifth semiconductor portion are directly connected through the sixthsemiconductor portion, wherein a minimum distance between the firstsemiconductor portion and the substrate is unequal to a minimum distancebetween the second semiconductor portion and the substrate, and whereina minimum distance between the fourth semiconductor portion and thesubstrate is unequal to a minimum distance between the fifthsemiconductor portion and the substrate.
 2. The display device of claim1, wherein the insulating film directly contacts the first semiconductorportion, the second semiconductor portion, and the structural member. 3.The display device of claim 2, further comprising a sixth electrodewhich overlaps the second semiconductor portion.
 4. The display deviceof claim 1, wherein the second electrode and the fifth electrode arespaced apart from the structural member.
 5. The display device of claim1, wherein the second electrode and the fourth electrode are disposed onthe structural member.
 6. The display device of claim 2, furthercomprising: a second gate electrode which is disposed directly on thesecond side surface of the structural member, wherein the second sidesurface is opposite to the first side surface.
 7. The display device ofclaim 6, wherein the second gate electrode is disposed on the topsurface of the structural member.
 8. The display device of claim 6,wherein the first semiconductor member is disposed on the first sidesurface of the structural member.
 9. The display device of claim 8,wherein the insulating film is disposed between the first semiconductormember and the first gate electrode.
 10. The display device of claim 6,wherein the second semiconductor member is disposed on the second sidesurface of the structural member.
 11. The display device of claim 10,wherein the insulating film is disposed between the second semiconductormember and the second gate electrode.
 12. A display device, comprising:a substrate; a structural member disposed on the substrate, andincluding a first side surface, a second side surface, and a top surfacewhich is disposed between the first side surface and the second sidesurface; a first gate electrode disposed on the first side surface ofthe structural member; an insulating film disposed on the first gateelectrode and the top surface of the structural member; a firstelectrode disposed on the insulating film; a second electrode disposedon the insulating film and spaced apart from the first electrode; afirst semiconductor member disposed on the insulating film, and whichcomprises a first semiconductor portion directly contacting the firstelectrode, a second semiconductor portion directly contacting the secondelectrode, and a third semiconductor portion; a fourth electrodedisposed on the insulating film; a fifth electrode spaced apart from thefourth electrode; a second semiconductor member disposed on theinsulating film, and which comprises a fourth semiconductor portiondirectly contacting the fourth electrode, a fifth semiconductor portiondirectly contacting the fifth electrode, and a sixth semiconductorportion; a passivation layer disposed on the first electrode, the secondelectrode, the fourth electrode, the fifth electrode, the firstsemiconductor member, and the second semiconductor member; a first pixelelectrode disposed on the passivation layer and connected to the secondelectrode disposed on the structural member through a first contact holewhich penetrates the passivation layer; and a second pixel electrodedisposed on the passivation layer and connected to the fourth electrodewhich is not disposed on the structural member through a second contacthole which penetrates the passivation layer, wherein the firstsemiconductor portion and the second semiconductor portion are directlyconnected through the third semiconductor portion, wherein the fourthsemiconductor portion and the fifth semiconductor portion are directlyconnected through the sixth semiconductor portion, wherein a minimumdistance between the first semiconductor portion and the substrate isunequal to a minimum distance between the second semiconductor portionand the substrate, and wherein a minimum distance between the fourthsemiconductor portion and the substrate is unequal to a minimum distancebetween the fifth semiconductor portion and the substrate.